Surface Mount Device Package Types

Micro surface mount device extended technology.

Surface mount device package types.

Surface mount device package types soic package. Surface mount device package types. Ceramic flat pack clga. Ceramic land grid array see lga cpga.

Ceramic pin grid array cpga graphic cqfp. Surface mount device or smd is the term used for the electronic components used within the surface mount assembly process. Bump chip carrier bga. Chip array small scale ball grid array cbga.

Bumpered quad flat pack cabga ssbga. A surface mount package is favored where a low profile package is required or the space available to mount the package is limited. As electronic devices become more complex and available space is reduced the desirability of a surface mount package increases. Sot 223 small outline transistor.

Concurrently as the device complexity increases the heat generated by operation. It is larger than the sot 23 and it measures 6 7 mm x 3 7 mm x 1 8 mm. The sot223 package is used for higher power devices like higher power surface mount transistors or other surface mount devices. Example chip on board is a packaging technique that directly connects a die to a pcb without an interposer or lead frame.

The small outline integrated circuit soic plastic package is shown above. Ceramic ball grid array cfp.